1. HEAT SINK SELECTION GUIDE

 

During the period of 1990 to 2016, new product developments in various fields moved toward the direction of concentrated heat sources with higher power and higher density. This trend applied more stringent requirements on   the cooling capacity and special limitation on a cooling system. It has been more obvious since 2010 when the density of industrial products increased rapidly with the renovation of high-density cooling technologies and solutions. In the last couple of years, skived fin, heat pipe thermal module, 3D/VC applications, and micro-channel liquid cooling have become the mainstream cooling techniques. 

 

 

   2. Lori Thchnology provides  feasible solution:

 

   • LORI THCHNOLOGY IS CAPABLE OF SUPPLYING SEVERAL NATURAL COOLING 

     

TECHNIQUES FOR SELECTION AS FOLLOWS.

 

Cooling by extruded materials: aluminum extruded heat sinks, aluminum alloy heat sinks, copper-aluminum composite heat sinks.

Cooling by material joining techniques: friction welding heat sinks, stacked fin heat sinks, stitched fin heat sinks.

Cooling by skived fin techniques: skived fin heat sinks, aluminum skived fin heat sinks, copper skived fin heat sinks.

Cooling by forging techniques: cold forging heat sinks, sunflower heat sinks.

Cooling by machining techniques: machined heat sinks, lathed aluminum heat sinks, lathed copper heat sinks.

Cooling by die-casting techniques: die-casting heat sinks, casting heat sinks. 

 

 

   • LED HEAT SINK COOLING SOLUTION 

 

       Schematic of simulation model and relevant parameters: Ambient temperature: 25℃

       Chipset power: 24W

       Heat sink: black anodized surface

       Emissivity: 0.85

 

 

 

     (Ambient temperature：25℃，Chipset power：24W，Maximum temperature on the heat sink: 63.92℃)

 

 

 

     Schematic of simulation results in the horizontal direction: